Developer Toolbox:
New Product Information for Indigo2, Power ChallengeM R8000 and upgrades
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CUSTOMER SERVICES ENGINEERING
NEW PRODUCT INFORMATION (NPI)
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Title: New Product Information for Indigo2TFP, Power Challenge M and Upgrades
Information Provided By: Frank Demcak
Date: 12-20-94 Revised 01-04-95
Location: A snapshot of all NPI documents sent is in:
csestuff.csd:/user/Knowledge/Archive/NPI
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NEW PRODUCT INFORMATION TEMPLATE
Title: New Product Information for Indigo2TFP, Power Challenge M and upgrades.
I. Product Description:
The Indigo2TFP and Power Challenge M (D-75301-S2-1) are the TFP ready
Indigo2 products. The engineering project called Teton developed these
TFP products. These products address the needs of heavy computational
users with extreme performance. The new MIPS R8000 processor module
provides two integer and two floating point units with 2MB of global
streaming cache. The product integrates a new TFP (MIPS R8000) processor
module, IP26 mother-board and requires an newer revision power supply.
These products are available as systems and upgrades (HU-TWOTFP) to
existing platforms. This architecture requires the use of the new 64 bit
IRIX called 6.0.1 .
II. Dependencies/Compatibility Information
These TFP products will only run the 64 bit IRIX called 6.0.1 or later.
The TFP architecture and 6.0.1 generate and operate on 64 bit applications
and data sets. IRIX 6.0.1 will execute 32 bit applications written
under IRIX 5.2 or earlier with reduced performance.
The New Product Information document for 6.0.1 lists the know bugs unique
to IRIX 6.0.1. Due to the aggressive schedule some peripheral driver
support will become available in the next 6.x release.
The Power Indigo2 and Power Challenge M have a SIMM height requirement
in SIMM banks B and C. These SIMM banks are locate under the new R8000
processor module and must not exceed 1.27 inches or 32mm. Some SGI and
third party memory vendors have shipped Toshiba 32MB SIMM memory that
exceeds this requirement. There is a process for SSEs to exchange
taller memory for memory that has been pre-screened for this upgrade
requirement. 32MB Toshiba memory SIMMs can be screened for height
by physically measuring the height of memory in your inventory or by
ordering the low profile SIMMs.
The HU-TWOTFP upgrade product will install in any existing Indigo2 or
Challenge M system.
Based on the IRIX 6.0.1 release the following peripherals and software
products may not work. Keep in mind that the hardware buses and
interfaces have not changed with the new IP26 however some drivers have
not been ported or tested.
Incompatible Products
---------------------
3270 Emulator not tested
4DDN device driver not ported
4DLT needs DLPI to function
5080 device driver not ported
CASEVision/Clearcase device driver not ported
Epoch device driver not ported
InPerson not tested
IRIS Channel Adapter device driver not ported
Japanese Language System no plan
OSI device driver not ported
Pascal not tested
SNA Server device driver not ported
SNA LU 6.2 needs SNA Server
Starter Video Development N/A
SX25 device driver not ported
Token Ring device driver not ported
Trusted IRIX no plan
Volume Manager device driver not ported
Obsolete Products
-----------------
IEEE-488 obsolete
**IMPORTANT NOTE** Additional information regarding the IRIX 6.0.1
software release is available in Donna Yobs IRIX 6.0.1 MR Information
NPI published December 21, 1994.
III. Product Numbers (Marketing Codes)
Systems and Upgrade marketing Codes
---------------------------------------------------------
WB-TWOTFPEX2 Power Indigo2 R8000, Extreme Graphics, 64MB memory,
2GB disk, 20" Mon
WB-TWOTFPXZ2 Power Indigo2 R8000, XZ Graphics, 64MB memory,
2GB disk, 20" Mon
D-75301-S2-1 POWER CHALLENGE M, 64MB memory,
2GB disk
HU-TWOTFP UPGRD TFP CPU FOR INDIGO2/CHALL M
Contents of Upgrade kit
-----------------------
HU-TWOTFP UPGRD TFP CPU FOR INDIGO2/CHALL M
024-0859-001 LABEL MOD NO. TFP IND2 UPGRADE
024-0531-001 LABEL SHIPPING ATTENTION SGI
024-0858-001 LABEL SYSTEM R8000 SGI INDIGO2
030-0519-003 PCA TETON TFP CPU UPGRADE
030-0659-002 PCA IP26
042-0101-001 LINER NOMEX R8000
090-0009-001 SHIPPING CONTAINER VME PCB
090-0069-001 SHIPPING CONTAINER BOX 20X20X15
090-0088-001 SHIPPING BOX PCB 12.25"X9.25"X3"
090-8022-001 SHIPPING BOX POWER SUPPLY SPARE
7270857 SCREW M3X30MM PAN HD PHL DR INT SEM
7270855 SCR M3X3/8 LG PHND PHH STL ZNC
9430814 POWER SUPPLY 74AC/DC 406W 6 OUTPUT Rev S
007-2596-001 MNL FLYER TETON UPGRADE INSTALL
813-0302-002 CD PACK IRIX 6.0.1
108-0130-001 MNL PWR INDIGO2/CHALLENGE UPG INST
RMA-HU-TWOTFP RMA PACKET I2 TO POWER I2 UPGRD
108-0130-001 MANUAL PWR INDIGO2/CHALLENGE UPGADE INSTRUCTIONS
List of Unique Spares
---------------------
013-1208-001 SPARES ASSY TETON/IP26/AUDIO
030-0519-003 PCA TETON TFP CPU UPGRADE
9430814 POWER SUPPLY 74AC/DC 406W 6 OUTPUT Rev S
Low Profile 32MB SIMM if needed
-------------------------------
9010000 SIMM 8MX36 32MB LOW PROFILE (see section XI.)
IV. Training plan
This is a simple SSE upgrade requiring the skills of an SGI SSE that
has previously stripped an Indigo2 system.
There will be an update to the Indigo2 Maintenance Manual self
study manual in Q3 95. This document will be available through
Corporate Training and Development when complete.
Until the maintenance course notes are complete the Indigo2TFP and
Power Challenge M Upgrade Instructions are well written and would
enable any SSE to install the TFP upgrade.
Also, the Power Indigo2 and Power Challenge M Upgrade Instructions,
IRIS Indigo2 Technical Report (includes R8000 specs) and other Indigo2
related documents will be shipped to service sites world-wide in late
December.
Updates have been broadcast on the CSD monthly video covering the
unique features of the TFP upgrade and issue SSEs should be aware of.
V. Documentation
There are the documents related to the Indigo2TFP and Power
Challenge M products :
108-0130-001 POWER Indigo2 and POWER CHALLENGE M
Upgrade Instructions (reviewed by CSD)
007-2546-001 MANUAL PWR CHALLENGE M OWNERS GUIDE
007-2596-00l FLYER TETON UPGRADE INSTALL
(Note about SIMMs and Audio Bd)
007- - There will be no updates to the Indigo2 Owner's
Guide. Systems will ship with the Indigo2
Owner's Guide. There weren't enough differences
in the products to justify making changes to
existing manuals.
SC4-W4D-6.0.1 IRIX WORKSTATION CD 6.0.1 (will ship with TFP systems)
813-0302-002 CD PACK IRIX 6.0.1 (will ship with TFP upgrades)
The installation instructions will be included in the installation package.
T4-IND2 Indigo2 Maintenance Student Workbook(updated Feb 95)
This document and related papers will be available on the CSD Web Server
at:
http://www.csd/Products/hdw/teton
Sales collateral from product marketing available through sales channels:
Power Indigo2 Indigo Family Data Sheet PWR-INDIGO2-DS(10/94)
Indigo2 Product Guide INDIGO2-TM-GD(09/94)
IRIS INDIGO2 Technical Report (version 2.0)
VI. Technical support delivery issues (Complexity of support expected)
This product is structured in the same fashion as the current Indigo2
and Challenge M. The really unique features are the mother-board and
TFP (R8000) processor module. The installation instructions for the
upgrade show how to remove and install the processor and mother-board.
The existing NAFO Support products are available for this product
including; Full Extended Warranty, Basic Extended Warranty, Parts Care,
IRIXCare, Full Support, Basic Support and On-site parts care.
The product is an SSE-only installation due to the complexity of the
mother-board removal and to insure the credited components(R4k PM, IP22)
are returned to manufacturing in Mountain View, California.
All areas of expertise can expect to receive customer calls on this
product as we do with the current Indigo2 family.
The only tools required to upgrade or maintain this new configuration
are a wrist strap, 6mm nut driver and #2 philips screw driver.
Although the installation manual and future training materials may
be helpful to the novice a current SSE will have no problems
maintaining or upgrading these systems.
**IMPORTANT NOTE** If low profile SIMM memory is required to complete
the upgrade, the SIMMs removed from the system must be returned to
logistics. Do not put the removed memory in the box with the IP22 and
R4400 processor module being returned to Mountain View.
The Indigo2TFP and Power Challenge M will be spared at the
030-xxxx-xxx parts level except for the mother-board and audio module
which will be at the 013-xxxx-xxx level. See the unique parts in
Section III for details.
Non-SGI/third party SIMMs that do not meet the 1.27inch/32mm height
requirements should be dealt with by the customer with their vendor.
VII. Marketing Information
This product is aimed at the 3D CAD modeling, animation, and interactive
data analysis markets. Although not advertised, the IP26 contains a ECC
single bit corrected memory system that will support up to 640MB
of main memory. This configuration supports large data arrays which can
be accessed very quickly with extra insurance against incidental data
corruption.
The approximate projected shipments for Indigo2TFP, Power Challenge M
and upgrades are:
For Upgrades world wide.
200 units Q2
250 units Q3
50 units Q4
For Indigo2TFP systems.
275 units Q2
350 units Q3
500 units Q4
For Power Challenge M systems.
25 units Q2
25 units Q3
25 units Q4
The NAFO price book currently lists both the Indigo2TFP and Power
Challenge M products as well as the upgrade. A number sales brochures
have been printed that graphically show the product like the Indigo2
Product Guide featuring the Power Desktop. The IRIS Indigo2 Technical
Report has been rewritten with R8000 features. The sales Data Sheet for
the Power Indigo2 family lists features and environmental specifications
on the back cover. All of these documents can be gotten through your sale
representative. Listed below are some of the more important environmental
specifications:
Power Requirements 100-120/200-240VAC
Heat Dissipation 1000 BTU/HOUR
Ambient Temperature +13 to +35 degrees C operating
-10 to +65 degrees C non-operating
Relative Humidity 10% to 80% operating no condensation
10% to 95% non-operating no condensation
Altitude 10,000 feet operating
40,000 feet non-operating
Vibration .02 inches, 5-19HZ
.35G, 19-500HZ
The product marketing manager for this Power Challenge M is Don Galles
and Raj Segal for Power Indigo2 and the TFP Upgrade.
VIII. Upgrade Policy
This is a customer purchased upgrade and an SSE-only install.
This upgrade can be installed on any revision Indigo2 or Challenge M system.
Installation instructions, prepaid shippers and RMA documents are shipped
with the Upgrade package.
IX. Known Bugs
See SIMM Memory Exchange Process (XI.) and FIB to be written.
See FIB on "Fast IU test failure" to be written.
See on-line release notes on 6.0.1
Also see Section II for incompatible or untested products.
Hardware problems and issues:
1. When swapping the IP26 for the IP22 be sure to properly seat
the EISA Backplane before re-installing ESIA cards. Symptoms
may be: No graphics or power and reset button doesn't function.
2. The new TFP CPU module covers the power connector near the
front of the machine so the TFP CPU Module must be lifted to
connect or disconnect the power supply connections.
3. Note that it is possible to push the power supply connectors
onto the mother-board connector pins and have the pins miss
the connector sockets and insert into the connector strain-relief.
The connection will look good until you look at it from above
the connector. The system will not power up or show any indication
of running power on diagnostics.
4. The TFP CPU module flex connector that attaches to the mother-board
is somewhat fragile and should be rocked into the mating mother-
board very carefully. If the cable connection is not properly made
the system may not run power on diagnostics and the health/power
LED will remain red.
5. The audio board is not shipped with the upgrade so make sure that
you remove it from the IP22 and move it to the IP26 before returning
the credited parts.
6. Some Teton Systems fail power-on Fast IU test. Pushing the reset
button will allow the machine to complete power-on diagnostics and
boot IRIX. This will affect some customers more than others, e.g.
Japanese or secure defense customers, who are usually required to
turn off computer equipment at night.
Also,
some systems intermittently fail the Fast IU test when running the
customer version of ide. The Fast IU test in ide is the same test
run during power-on diagnostics. Pushing the reset button and
rerunning ide usually passes the Fast IU test.
There is a letter from product marketing that describes how to get
around the error condition and explains that a replacement IP26
PROM will be shipped to correct this error. This letter will be
included in all units shipped with this problem.
X. Follow-Up
On a weekly or bi-weekly basis we will be feeding field call summaries
to the product division to tell them how the TFP systems are performing
We will be using an exiting tools via the World Wide Web
(http://www.csd/Projects/Callsum/Reports/Home.html)
For international tracking we will be relying on email and conversations
with International support centers for service related data.
At the time of release there are no know show-stopper issues in the
hardware or software.
A FIB will be written that details the SIMM Height issue.
XI. SIMM Memory Exchange Program
Late in release of the Indigo2 TFP upgrade package we found that SGI
and some third-party manufacturers have shipped some 32MB SIMMS that
will not fit under the TFP CPU module in memory banks B and C.
The height specification for Indigo2 SIMMS is 1.27 inches or 32mm high.
Toshiba shipped 32MB SIMMs that were about 1.33 inches or 34mm.
Although the amount of interference is only about 1/10th of an inch,
it could be enough to flex the CPU module or mother-board.
Only a small number of the tall Toshiba 32MB SIMMs were shipped and
even fewer were shipped in multiple memory banks. System configured with
one bank of tall Toshiba 32MB SIMMs can be reconfigured by moving the tall
memory to Bank A of the mother-board.
There may be cases where customers have ordered 256MB or 384MB and they
could have two banks of memory that are too-tall. In this case it would be
necessary for you to order a set of 4 replacement 32MB SIMMs that meet
the 1.27 inch specification. Only systems with 256MB or 384MB of SIMM
memory could be suspected of having this problem. HINV can be used to
verify the amount of memory a customer's machine has prior to placing any
orders.
Early January we will have a pre-punched non-electro-static sensitive card
that you can use to screen or check the size of SIMMs you have.
I will be advancing copies of these gauges to service providers world
wide as well as one will going into every TFP upgrade kit. There is also
a gauge silk screened on the insulator card that is screwed down on top of
the TFP CPU Module.
We have created a part number for replacement SIMMs on a call-by-call
basis. The SIMM part number is 90100000. If these SIMMs are requested
they must be returned to logistics against the same call ID opened to
request the SIMMs. The part number used to return the tall memory would
be the old SIMM part number 9016824.
If you are already on-site and doing the upgrade and find that the customer
has two banks of SIMMS that are too-tall , the upgrade can be completed
with one bank installed in Bank A and a replacement set of SIMMs ordered
for Bank B or C.
If you know the customer's machine has 256 or 384MB of memory you might
pre-order 32MB SIMMs .
REMEMBER, THE MEMORY MUST BE RETURNED ON THE OPEN CALL ID WHETHER IT WAS
USED OR NOT. DO NOT RETURN THE 32MB SIMMS YOU ORDERED AGAINST THE
UPGRADE IN THE SHIPPING BOX WITH THE RETURNING PARTS.
A final note on these TFP upgrades: our research indicates that the
highest percentage of systems that may run into this SIMM height problem
are located in Japan since most of their orders include large memory
system. Less than 200 systems world-wide could have this problem and
only a few of those will be upgraded. There may be a few in the US and
Canada however we don't think there are any in Europe or the UK.
If you find that a customer has purchased their own memory and it exceeds
the height specification, the customer will have to work with their vendor
or with their salesman for special consideration.
XII. Credited Parts Return Process
IMSD Manufacturing has set up an RMA packet for Domestic(NAFO) and
International parts return. This packet is used to return the IP22,
TFP CPU Module and power supply removed from the customers machine.
There is an airbill, address label, RMA # and customs forms to return
the credited components (customer has been pre-credited for the returning
parts). A separate set of forms need to be filled out for each returning
part, not one form for the entire package. This will help eliminate
missing parts in the larger packages and make it easier for customs.
The SSE installer is responsible for getting the returning parts
to the shipper and back to manufacturing. For the first quarter all
credited parts will be coming back to Mountain View, however future
upgrades may be returned to other manufacturing sites world wide.
Follow the instructions enclosed in the RMA package. The shipping
instructions sheet has a contact and phone number if you run into any
problems with the RMA process.
Once you have sent the parts to SGI, send an e-mail to Randy Bresee
at randyb@csd, referring to the HU-TFPTWO Upgrade and informing him of
the branch office/subsidiary and the RMA number. This will create a
double path to enable us to better track the parts to ensure you get
credit and minimize the chances of your parts getting lost in the system.